Fact Sheet
Chips JU Objectives
a)
Reinforce the Union’s strategic autonomy in electronic components and systems to support future needs of vertical industries and the economy at large. The overall target is to contribute towards doubling the value of the design and production of electronic components and systems in Europe by 2030, in line with the weight of the Union in products and services.
b)
Establish Union scientific excellence and innovation leadership in emerging components and systems technologies, including in activities related to lower TRLs; and promote the active involvement of SMEs, which, for all research and innovation activities, including those related to the Chips for Europe Initiative (also referred to as ‘the Initiative’) established by Regulation (EU) 2023/1781 (hereinafter referred as ‘the Chips Act’), shall represent at least one third of the total number of participants in indirect actions and at least 20 % of public funding should go to them.
c)
Ensure that components and systems technologies address Europe’s societal and environmental challenges. The target is to align with the Union policy on energy efficiency and contribute towards the reduction of energy consumption by 32,5 % in 2030.
d)
Achieve large-scale technological capacity building and support related research and innovation activities throughout the Union’s semiconductor value chain to enable development and deployment of cutting-edge semiconductor technologies, next-generation semiconductor technologies and cutting-edge quantum technologies and the innovation of established technologies that will reinforce advanced design, systems integration and chip production capabilities in the Union, thereby increasing the competitiveness of the Union; and contribute to the achievement of the green and digital transitions, in particular by reducing the climate impact of electronic systems, improving the sustainability of next-generation chips and strengthening the circular economy processes, contribute to quality jobs within the semiconductor ecosystem and address security-by design principles, which provide protection against cybersecurity threats.
a)
Support research and development for establishing design and production capabilities in Europe for strategic application areas.
b)
Launch a balanced portfolio of large and small projects supporting the fast transfer of technologies from the research to the industrial environment.
c)
Foster a dynamic Union-wide ecosystem based on digital value-chains with simplified access to newcomers.
d)
Support research and development for enhancing component technologies that guarantee security, trust and energy-efficiency for critical infrastructures and sectors in Europe.
e)
Foster mobilisation of national resources and ensure coordination of Union and national research and innovation programmes in the field of electronic components and systems.
f)
Establish coherence between the Strategic Research and Innovation Agenda of the Chips Joint Undertaking and Union policies so that electronic components and systems technologies contribute efficiently.
g)
Build up advanced design capacities for integrated semiconductor technologies.
h)
Enhance existing and develop new advanced pilot lines across the Union to enable development and deployment of cutting-edge semiconductor technologies and next-generation semiconductor technologies.
i)
Build advanced technology and engineering capacities for accelerating the innovative development of cutting-edge quantum chips and associated semiconductor technologies.
j)
Establish a network of competence centres across the Union by enhancing existing or creating new facilities.
Executive Director and Staff
Executive Director
In October 2023, Prof. Jari Kinaret assumed the role of Executive Director at the Chips JU.
In 2024, the Executive Director adopted 73 decisions, mainly concerning minor amendments to the Multiannual Work Programme, the adoption of supporting documents for calls, internal administrative organisation, and confidential HR issues.
Staff
By the end of 2024, the Chips JU had 38 staff members.
Governance
Governing Board
The Governing Board (GB) is composed of the European Commission, Participating States, and Private Members.
During 2024, the Chips JU GB held 10 meetings and adopted 29 decisions, through meetings and written procedures.
Chair Ralf Bornefeld (until 20.11.2024) Stefan Finkbeiner (from 21/11/2024)
Vicechairs Jean-Luc di Paola Galloni (Private Members Board Chair)
Gustav Kalbe (European Commission lead delegate)
Kari Leino (Public Authorities Board Chair)
Public Authorities Board
The Governing Board is composed of the European Commission and Participating States.
During 2024, the Chips JU PAB held 10 meetings and adopted 32 decisions, through meetings and written procedures.
Chair Kari Leino
Vicechair Francis Deprez
Private Members Board
The Private Members Board is composed of the Private Members (AENEAS, EPoSS and INSIDE).
During 2024, the Chips JU PMB held 11 meetings and adopted two decisions concerning the PMB Rules of Procedure and the composition of the PMB.
Chair Jean-Luc di Paola Galloni
Vicechairs Ina Sebastian (AENEAS)
Stefan Finkbeiner (EPOSS)
Total budget
Commitment appropriations
Payment appropriations
Grants
In 2024
21 grants resulting from the ECS Calls of 2023 were signed, for a total value of 236.971.793,14 €, 6 grants, 3 Hosting Agreements and 13 Joint Procurement Agreements resulting from the Chips for Europe Initiative Calls of 2023 were signed, for a total value of 1.481.102.894,95 €
Call implementation
Calls launched in 2024, covering 16 topics
Submitted proposals, of which 98 were eligible
Granted proposals
Participation
792 beneficiaries in funded projects resulting from the ECS Calls of 2024.
SMEs
24% of SMEs and 21% of EU funding received by those SMEs
Large companies
38,1% of private for profit/large companies and 45% of EU funding received by those companies
Other
Strategic Research and Innovation Agenda
The Electronic Components and Systems Research and Innovation Agenda (ECS SRIA) is developed by the experts of the ECS community, coordinated by the industry associations: AENEAS, EPoSS and INSIDE.
The ECS SRIA is updated every year to reflect the market trends, dynamics of the industry, the evolution of technology, the application fields and the long term vision.
