Calls
The Chis JU launched two calls for Competence Centres.
CCC1 - Call for Competence Centres
Chips Competence Centres (Chips CCs) are key to the success of the Chips for Europe Initiative. These centres will support the semiconductor ecosystem—especially start-ups and SMEs—by offering access to technical expertise, design support, training, and funding guidance.
Participating states will also be able to define their own technological priorities, ensuring that each centre is aligned with national strengths and regional needs.
Operating on an open and non-discriminatory basis, the centres will help bridge companies with essential infrastructures and initiatives established by the Chips JU.
Services include:
- Access to pilot lines and the European virtual design platform
- Skills development and training activities
- Support in finding investors and leveraging local expertise
- Acting as first contact points for SMEs and start-ups
- Promoting Chips JU activities and success stories
- Facilitating connections across the European Chips CC network
EU budget for the call
CCC2 - Network of Competence Centres
EU budget for the call
A dedicated Coordination and Support Action (CSA) will reinforce the European semiconductor ecosystem by connecting and supporting Chips Competence Centres (Chips CCs) across Member States.
The coordination action of CCCs is fully funded by the JU through the Digital Europe programme, all other calls are co-funded by the participating states the JU contribution is up to 50%
This network will help SMEs adopt semiconductor technologies by enabling access to pilot lines, the European virtual design platform, and training services tailored to local and regional needs.
The overall goal is to create a central European hub that connects semiconductor expertise, supports user engagement, and strengthens training and innovation throughout the network.
The CSA will:
- Coordinate knowledge sharing and best practices among Chips CCs
- Enhance visibility and outreach, especially towards SMEs and industry
- Promote services, support technology transfer and IP management
- Strengthen links with other European initiatives on skills and training
- Establish a communication platform and organise outreach activities
- Track key performance indicators and support matchmaking across centres
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Timeline
The submission, evaluation, and selection of both calls took place in 2024. For the competence centre evaluation, two evaluators were assigned per proposal.
Call timeline
Proposals
CCC1 - Call for Competence Centres
Submitted proposals
No CCC proposal was submitted for CY, IT, and LU. Consequently, a second call for CCCs was launched on 17 December 2024. The submission, evaluation and selection of this second set of CCCs was performed in April 2025.
Selected proposals
In the competence centres call, in most of the cases, a single proposal per participating state was submitted. However, for Belgium, Poland and Spain multiple proposals were submitted. In the final selection Belgium and Spain supported 2 competence centres each.
The set of selected competence centres cover big part of the semiconductor value chain including design, equipment, as well as broad spectrum of technologies and application areas, skills, services to SMEs and startups, etc.
ASTEERICS
Attractivity, Services and Training for Energy Efficiency Reach on Integrated Circuits and System
- Microelectronics
- MPW services
- FD-SOI
- Photonics
AT-C3
Austrian Chips Competence Centre
- Semiconductor ecosystem
- Start-up & SME support
- Training / Skill Development
BETeC2
Slovakia
Slovak semiconductor and back-end technologies Competence Centre
- Design and prototyping of new power systems
- wide bandgap power devices packaging
- training and upskilling to strengthen the workforce
CC Chip.si
Slovenian Competence Center on Chips and Semiconductor Technologies
- Niche electronic devices
- photonic and quantum components
CC-NORCHIP
CC-NorChip - A Norwegian competence centre for chip and sensor technologieS
- Sensors
- Micro- nano fabrication
- Photonics
- Packaging
ChipNL CC
ChipNL Competence Centre
- Semiconductor Manufacturing Equipment and Heterogeneous Integration
- Photonics
- Quantum technologies
- Chip Design
ChipsC2-LT
Lithuanian Chips Competence Centre
- Chips Design
- Power
- Photonics Integrated Circuits
- Heterogeneous integration
G3C
German Chip Competence Centre for Chip-, Heterogenous Integration Systems- and 2.5/3D System Design and fabrication
- Chiplet design
- Heterogenous integration
- 2.5/3D system design
HCCC
Hellenic Chips Competence Centre
Analogue, mixed-signal, and RF components
photonic integrated circuits
advanced sensors
embedded AI circuits and low-power microprocessors for IoT
HCHiP
Hungarian Centre for Heterogeneous integration and Packaging
- Heterogeneous Integration
- Packaging
- Chiplets
- EDA
InnoSemi
Innovation in Semiconductors Competence Center
- Chip design
- Heterogonous integration
- Photonics
- Quantum
KIIP
Estonian Chips Competence Centre for Knowledge transfer in Innovative Integrated circuits and Processes
- RISC-V, open EDA
- Hardware security
- IC/system test and safety
- Functional verification
LMCC
Microchip Competence Centre of the Republic of Latvia
- Integrated Photonics
- Quantum deviceS
- Microelectronics (include design) and Cristal Growth
- Skills
MCC
Malta Competence Centre
- Fabless startup incubator, including design
- heterogeneous integration and advanced packaging
- Skills in chips design
MicroNanoSpain
Spanish Competence Centre for Microelectronics
- Micro-nanoelectronics lab to fab and design
- RISC-V
- Photonics
- Quantum
PIXSpain CC
Photonic Chips Spain Competence Center
- Photonics
- Technology transfer
- Support financial access
CC2 - Network of Competence Centres
Two proposals were submitted for the Network of Competence Centres call. The aCCCess proposal was selected for funding.
Submitted proposals
Two proposals were submitted in response to the Call, which have satisfied the eligibility criteria;
The proposals have been evaluated by independent experts in accordance with Chips evaluation and selection procedures related to Calls for proposals, under the coordination of the Chips JU Office;
Selected proposal
Following the evaluation of the proposals, an evaluation summary report was produced concluding that the two proposals reached the evaluation threshold
The PAB should select the proposals submitted to Chips 2024-CCC-2 Call with the indicative maximum public funding.
The PAB ranking considers the points resulting from the total scores of the evaluation by experts and the level of synergy of the proposed work with EU and national R&D&I policies.
aCCCess - alliance of Chips Competence Centers for enhanced semiconductor services
The aCCCess project unites a consortium of 7 experienced partners from cluster organisations and consultancies and 10 associated partners, including candidates applying for the Chips Competence Centers (CCC) call, all working to establish the European Network of Chips Competence Centers (ENCCC). The Associated Partners also include 3 committed Chips Pilot Lines and the consortium leader applying for the Design Platform.
The project is designed to guide the CCCs and create maximum synergies during the set-up and it aims to amplify the European semiconductor ecosystem's impact through coordinated and federated actions of the CCCs with the CPLs and the DP. The ENCCC board is organized in 5 focus groups covering Operations and Best Practices, Outreach and Events, Common Technology Offers, Training and Skills Development, and Finance. These focus groups will guide harmonized practices e.g. for training, IP management, communications or technology transfer.
aCCCess activities will support the CCC set-up sthrough online and in-person events with specific actions towards SMEs, an annual community event fostering cross-border collaborations.
To simplify access to CCC services, training and technology offers, aCCCess will create a common on-line marketplace showcasing the CCCs service catalogues, with AI aided maintenance and matchmaking opportunities. Additionally, aCCCess will promote investment opportunities through its Venture Capital network and the Chips Finance Lab. An annual pitching event for start-ups, in collaboration with the EIB, EIF, and EIC, will highlight these opportunities
aCCCess will build a strong brand as a Think Tank hosting monthly webinars with industry experts discussing trends and fostering Public-Private Partnerships and best practice exchanges on cluster management and opperations. Pilot Lines and Design Platforms will offer dedicated sessions to train CCC on resource provision, with webinars promoting their resources more broadly.
Map of the European Chips Competence Centres (including centres selected in 2025)
