Call launch
On 6 February 2024, the Chips JU launched a call for Research and Innovation Actions (lower TRLs) that consisted of a global topic and one focus topic.
The global topic covered all topics described in the SRIA and aimed at the reinforcement of the industrial competitiveness, stimulating industrial innovation and transfer of innovation from research environments (RTOs and universities) to SMEs and Large Enterprises. Projects selected should demonstrate high impact, European wide collaboration with a mixed participation of large enterprises, SMEs and academia.
The following focus topic was included in the RIA call 2023-2: • Call 2024-2 Topic 2 RIA: Sustainable and greener manufacturing; related to reducing the environmental impact of the semiconductor component manufacturing.
Calls budget
Timeline
Call timeline
Submitted Proposals
The Chips JU received 23 proposals for the Research and Innovation Action calls: 22 submissions for the 2024-IA-2 call, and one submission for the focus topics call on sustainable and greener manufacturing.
The number of submissions to the focus topics continues to be low, despite efforts to increase their visibility and making sure that there was enough time to prepare proposals.
Selected proposals
The projects are selected by the PAB based on the ranking of the experts, taking into account the overall consistency of the portfolio approach as well as national strategic priorities in accordance with article 12.1 of the SBA. Focus topics were selected first, and then the projects submitted from the bottom-up parts of the calls were selected.
From the 22 proposals submitted to the Global call, one was ineligible and another one was below the threshold. In total, four proposals were retrieved for funding, three for the global call and one from the focus topic call.
The success rate for the RIA proposals dropped significantly in 2024. One reason could be the lower budget allocated to bottom-up calls, compared to past years.
Projects summary
HiPower 5.0
Leading edge Semiconductor, Integration, and Control System Technologies for highly compact and smart eDrive Components towards more sustainable Power Electronics 5.0
HiPower 5.0 will develop highly integrated eDrive components for the automotive and maritime domain using leading edge GaN semiconductors and power electronics integration technologies.
NexTArc
Next Generation Open Innovations in Trustworthy Embedded AI Architectures for Smart Cities, Mobility and Logistics
NexTArc focuses on trustworthy and cybersecure components and systems addressing the challenges of mobility in urban and industrial spaces.
MOSAIC
Mosaic of essential electronic components and systems (ECS) for our automated digital future in industry and mobility
MOSAIC tackles the challenge of integrating diverse perception hardware configurations, ensuring that automated systems can perceive their surroundings in a non-invasive manner with unparalleled accuracy and decreased complexity, tailored to the demands of automated systems.
